| *Bulk Metal® Foil is a registered trademark of Vishay Precision Group, Inc. (VPG) | © 1999-2025 Texas Components Corporation | 
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Packaged Networks and Multi-Chip Modules | 
Data Sheet  | 
        Product Image  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Glass to Metal Seal Headers  | 
        Through Hole  |  
        0.005  |  
        2  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Ceramic Dual In Line Package  | 
        Through Hole  |  
        0.005  |  
        2.0  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Ceramic Dual In Line Package  | 
        Through Hole  |  
        0.005  |  
        2.0  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        PRND Networks Qualified to MIL-PRF 83401 Characteristic "C" Schematic A  | 
        Through Hole  |  
        0.1  |  
        5.0  |  
        100  |  
        10K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Ceramic Dual In Line Package  | 
        Through Hole  |  
        0.005  |  
        2.0  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        PRND Networks Qualified to MIL-PRF 83401 Characteristic "C" Schematic A  | 
        Through Hole  |  
        0.1  |  
        5.0  |  
        100  |  
        10K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Ceramic Dual In Line Package  | 
        Through Hole  |  
        0.005  |  
        2.0  |  
        5  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Ceramic Dual In Line Package  | 
        Through Hole  |  
        0.005  |  
        2.0  |  
        5  |  
        80K  | 
        
  | Networks  | 
        High Temperature  | 
        Custom Hermetically Sealed Precision Resistor Network Devices For High Temperature (PRND) With Screen/Test Flow in Compliance with EEE-INST-002 (Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-83401  | 
        Through Hole  |  
        0.01  |  
        2.5  |  
        5  |  
        60K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Gull Wing Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Gull Wing Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Gull Wing Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Gull Wing Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  | 
        
  | Networks  | 
        Resistor Networks  | 
        Hermetic Resistor Networks in Leadless Chip Carrier (LCC) Configuration  | 
        Surface Mount  |  
        0.005  |  
        2.0  |  
        5.0  |  
        80K  |