| *Bulk Metal® Foil is a registered trademark of Vishay Precision Group, Inc. (VPG) | © 1999-2017 Texas Components Corporation |
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Texas Components Corporation |
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Page 1 of 1Sort by: Function
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Hybrid Chips |
Data Sheet |
Product Image |
|
| Resistors |
Resistor Networks |
Hybrid Chips (Gold Plated Pads) |
Surface Mount |
0.005 |
5 |
5 |
10K |
|
| Resistors |
Resistor Networks |
Hybrid Chips (Gold Plated Pads) |
Surface Mount |
0.005 |
5 |
5 |
33K |
|
| Resistors |
Resistor Networks |
Hybrid Chips (Gold Plated Pads) |
Surface Mount |
0.005 |
5 |
33K |
80K |
|
| Resistors |
Resistor Networks |
Z Foil Hybrid Chips (Gold Plated Pads) |
Surface Mount |
0.01 |
0.2 |
50 |
30K |
|
| Resistors |
Resistor Networks |
Z Foil Hybrid Chips (Gold Plated Pads) |
Surface Mount |
0.01 |
0.2 |
50 |
5K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
100 |
5K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
8K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
25K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
30K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
70K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Aluminum Wire Bondable Chip or Flip Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
125K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
10K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
30K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
30K |
80K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
100 |
5K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
8K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
25K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
30K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
70K |
|
| Resistors |
High Temperature |
Ultra High Precision Z1-Foil Technology Gold Wire Bondable Chip Resistor for Hybrid Circuits for High Temperature Applications up to +240°C, Long Term Stability of 0.05%,TCR to ± 1ppm/°C |
Surface Mount |
0.02 |
2.5 |
5 |
125K |